Application Areas » Other X-ray Applications » Counterfeit Electronics X-ray Inspection

COUNTERFEIT ELECTRONICS -
X-RAY INSPECTION

Counterfeit PCB components are of increasing concern to EU electronics manufacturers. The threat arises from the continual growth of operations where there is minimal cultural concern, and little legislative protection of intellectual property, which
encourages the production of
counterfeit components.

X-ray technology has been previously used for counterfeit electronics X-ray inspection, and process & product control of different components . Our new and innovative X-ray systems push the counterfeit electronics X-ray inspection level to the real need – to detect what is critical for process & product quality inspection.

Counterfeit components are defined as: substitutes or unauthorized copies of a product, a product used in which the materials used or the performance of the product has changed without notice, or a substandard component misrepresented by the supplier.

X-ray detection of counterfeit electronics and components - chip example - product & process control 2

THE VALUE OF LOW-ENERGY X-RAY TECHNOLOGY:

  • reducing loss and making best use of raw materials
  • better product classification and a better product price
  • avoiding customer complaints
  • a robust, reliable, and safe inspection technology
  • hygienic design guidelines

Our “Chipcheck” X-ray system also provides real-time inspection of single PCB components with a manual manipulator. Providing this together with inspection for counterfeit components, and at low cost,
helps SMEs to justify acquisition and utilization of this inspection technology.

OBJECTIVE

The detection of counterfeits has become increasingly difficult because the majority of parts have the same or similar markings as their qualified counterfeit. The only way to determine genuine components from a counterfeit version is to X-ray them. X-ray inspection can reveal different sized die (indication of different components, different specifications), different bond wire layout and missing bond wire, different heatsink sizes (effects thermal characteristics of components) and absence of die.

The X-ray inspection technology shall enable to inspect all electronics components at goods inwards automatically and without being destructive to the component or the shipment packaging. The system should work with all component feeding methods including tube, waffle tray and tape & reel (the number of components supplied on tape & reel can be anywhere from 100 to 10,000). The inspection technology will verify and authenticate supply chains and in general, help eradicate the threat of counterfeit electronic components.

counterfeit electronics detection xray
X-ray detection of counterfeit electronics and components – chip example 2 – product & process control

SOLUTION

The InnospeXion “Chipcheck” X-ray system

An automated microfocus (or mini-focus) X-ray inspection system which can accept all component feeding methods including tube, waffle tray and tape & reel (the number of components supplied on tape & reel can be anywhere from 100 to 10,000 parts).

The system is cost-wise optimized towards a high resolution and a moderate resolution version, based on the relevant component selection.

The system features an automatic software which increases the reliability of automated counterfeit component sentencing. The software may be tailored for specific components and specific counterfeit threats.

A secondary function of the system is to provide real-time inspection of single PCB components with a manual manipulator. Providing this together with inspection for counterfeit components, and at low cost, helps SMEs to justify acquisition and utilization of this inspection technology.

The ChipCheck system is offered with various options, at a pricing < 100 K€, consistent with the objective of supporting SME’s with a need of a quality system that can offer an inspection with a low cost per component.

COUNTERFEIT ELECTRONICS
X-RAY INSPECTION

ADDITIONAL READING

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